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1

Interface Formation in the US-Wedge/Wedge-Bond Process of AlSi1/CuNiAu Contacts

Ute Geissler, Jürgen Funck, Martin Schneider-Ramelow, Hans-Jürgen Engelmann, Ingrid Rooch, Wolfgang H. Müller, Herbert Reichl

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 485 KB

english, 2011

2

Microstructure and degradation mechanisms of TaSiN diffusion barriers for Cu interconnects

Engelmann, Hans-Jürgen, Hübner, René, Hecker, Michael, Mattern, Norbert, Wenzel, Christian, Zschech, Ehrenfried, Wetzig, Klaus

Journal:

Microscopy and Microanalysis

Year:

2003

Language:

english

File:

PDF, 135 KB

english, 2003

3

Einsatz physikalischer Analysemethoden zur Charakterisierung von dünnen Schichten und Grenzflächen in der Halbleiterindustrie. Application of physical analysis techniques for thin film and interface characterization in semiconductor industry

Ehrenfried Zschech, Eckhard Langer, Hans-Jürgen Engelmann, Kornelia Dittmar, Werner Blum

Journal:

Vakuum in Forschung und Praxis

Year:

2001

File:

PDF, 374 KB

2001

4

Zum Einfluß des Ni-Gehaltes austenitischer Stähle auf den Mechanismus der Rißausbreitung bei der chloridinduzierten transkristallinen Spannungsrißkorrosion

Dr. rer. nat. Hans-Jürgen Engelmann, Dr. rer. nat. Kurt Mummert

Journal:

Materials and Corrosion/Werkstoffe und Korrosion

Year:

1993

Language:

german

File:

PDF, 1.63 MB

german, 1993

5

Chemical bonds in damaged and pristine low-κ materials: A comparative EELS study

Heiko Stegmann, V. Burak Özdöl, Christoph Koch, Peter A. van Aken, Hans-Jürgen Engelmann, Pavel Potapov, Ehrenfried Zschech

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 534 KB

english, 2008

6

Investigation of ultrathin tantalum based diffusion barrier films using AES and TEM

Kornelia Dittmar, Hans-Jürgen Engelmann, M. Peikert, E. Wieser, J.V. Borany

Journal:

Applied Surface Science

Year:

2005

Language:

english

File:

PDF, 279 KB

english, 2005

7

Nano-beam electron diffraction evaluation of strain behaviour in nano-scale patterned strained silicon-on-insulator

Angelika Hähnel, Manfred Reiche, Oussama Moutanabbir, Horst Blumtritt, Holm Geisler, Jan Hoentschel, Hans-Jürgen Engelmann

Journal:

physica status solidi (c)

Year:

2011

Language:

english

File:

PDF, 678 KB

english, 2011

8

A sensitive method for testing the quality of organ culture media and of individual medium components in a cornea bank

K. Engelmann, Angela Sobottka Ventura, Dagmar Drexler, Hans-Jürgen Staude

Journal:

Graefe's Archive for Clinical and Experimental Ophthalmology

Year:

1998

Language:

english

File:

PDF, 1.09 MB

english, 1998

9

Characterization of barrier/seed layer stacks of Cu interconnects by electron tomographic three-dimensional object reconstruction

Heiko Stegmann, Hans-Jürgen Engelmann, Ehrenfried Zschech

Journal:

Microelectronic Engineering

Year:

2003

Language:

english

File:

PDF, 637 KB

english, 2003

10

Elemental mapping of multilayered structures: A method to reconstruct 2D chemical maps from a set of 1D line scans

Pavel Potapov, Hans-Jürgen Engelmann

Journal:

Ultramicroscopy

Year:

2011

Language:

english

File:

PDF, 932 KB

english, 2011

11

Exhaled breath condensate acidification in acute lung injury

Christian Gessner, Stefan Hammerschmidt, Hartmut Kuhn, Hans-Jürgen Seyfarth, Ulrich Sack, Lothar Engelmann, Joachim Schauer, Hubert Wirtz

Journal:

Respiratory Medicine

Year:

2003

Language:

english

File:

PDF, 134 KB

english, 2003

12

Enhanced growth and Cu diffusion barrier properties of thermal ALD TaNC films in Cu/low-k interconnects

Wojcik, Henry, Hossbach, Christoph, Kubasch, Christoph, Verdonck, Patrick, Barbarin, Yohan, Merkel, Ulrich., Bartha, Johann W., Hübner, Rene, Engelmann, Hans-Jürgen, Friedemann, Michael

Journal:

Microelectronic Engineering

Year:

2013

Language:

english

File:

PDF, 2.30 MB

english, 2013

13

In-situ study of the TDDB-induced damage mechanism in Cu/ultra-low-k interconnect structures

Liao, Zhongquan, Gall, Martin, Yeap, Kong Boon, Sander, Christoph, Mühle, Uwe, Gluch, Jürgen, Standke, Yvonne, Aubel, Oliver, Vogel, Norman, Hauschildt, Meike, Beyer, Armand, Engelmann, Hans-Jürgen, Z

Journal:

Microelectronic Engineering

Year:

2015

Language:

english

File:

PDF, 4.61 MB

english, 2015

14

[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Small grain and twin characterization in sub-100 nm Cu interconnects using the conical dark-field technique in the transmission electron microscope

Hubner, Rene, Engelmann, Hans-Jurgen, Zschech, Ehrenfried

Year:

2010

Language:

english

File:

PDF, 715 KB

english, 2010

15

[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - CPI assessment using a novel characterization technique based on bump-assisted scratch-indentation testing

Geisler, Holm, Lehr, Matthias U., Platz, Alexander, Kuchenmeister, Frank, Mayer, Ulrich, Rossler, Thomas, Paul, Jens, Lehmann, Lothar, Hofmann, Petra, Engelmann, Hans-Jurgen

Year:

2011

Language:

english

File:

PDF, 3.56 MB

english, 2011

16

Improving Accuracy and Precision of Strain Analysis by Energy-Filtered Nanobeam Electron Diffraction

Hähnel, Angelika, Reiche, Manfred, Moutanabbir, Oussama, Blumtritt, Horst, Geisler, Holm, Höntschel, Jan, Engelmann, Hans-Jürgen

Journal:

Microscopy and Microanalysis

Year:

2012

Language:

english

File:

PDF, 746 KB

english, 2012

17

Effect of interface strength on electromigration-induced inlaid copper interconnect degradation: Experiment and simulation

Zschech, Ehrenfried, Engelmann, Hans-Jürgen, Meyer, Moritz Andreas, Kahlert, Volker, Vairagar, Anand V., Mhaisalkar, Subodh G., Krishnamoorthy, Ahila, Yan, Minyu, Tu, K. N., Sukharev, Valeriy

Journal:

Zeitschrift für Metallkunde

Year:

2005

Language:

english

File:

PDF, 370 KB

english, 2005

18

AES and Related Techniques for Yield Improvement, Metrology and Development Support of ULSI Circuits Manufactured in ≤ 28nm CMOS Technology

Dittmar, Kornelia, Ohsiek, Susanne, Klein, Christoph, Weisheit, Martin, Lenski, Markus, Erben, Elke, Triyoso, Dina, Binder, Robert, Metzger, Joachim, Hempel, Klaus, Engelmann, Hans-Jürgen

Journal:

Microscopy and Microanalysis

Year:

2014

Language:

english

File:

PDF, 1.37 MB

english, 2014

19

The application of low energy ion scattering spectroscopy (LEIS) in sub 28-nm CMOS technology

Dittmar, Kornelia, Triyoso, Dina H., Erben, Elke, Metzger, Joachim, Binder, Robert, Brongersma, Hidde H., Weisheit, Martin, Engelmann, Hans-Jürgen

Journal:

Surface and Interface Analysis

Year:

2017

Language:

english

File:

PDF, 1001 KB

english, 2017

20

Conceptual Design and Demonstration Tests for Disposal of Spent Fuel in a Salt Repository

Engelmann, Hans-Jürgen

Journal:

Nuclear Technology

Year:

1998

Language:

english

File:

PDF, 1.93 MB

english, 1998

21

Site-controlled formation of single Si nanocrystals in a buried SiO 2 matrix using ion beam mixing

Xu, Xiaomo, Prüfer, Thomas, Wolf, Daniel, Engelmann, Hans-Jürgen, Bischoff, Lothar, Hübner, René, Heinig, Karl-Heinz, Möller, Wolfhard, Facsko, Stefan, von Borany, Johannes, Hlawacek, Gregor

Journal:

Beilstein Journal of Nanotechnology

Year:

2018

Language:

english

File:

PDF, 2.47 MB

english, 2018

22

Analysis 2 (Integralrechnung und mehrdimensionale Analysis) || Analysis 2

Dobner, Hans-Jürgen, Engelmann, Bernd

Year:

2013

Language:

german

File:

PDF, 2.95 MB

german, 2013

23

Analysis 2 (Integralrechnung und mehrdimensionale Analysis) || Lösungen

Dobner, Hans-Jürgen, Engelmann, Bernd

Year:

2013

Language:

english

File:

PDF, 3.11 MB

english, 2013

24

Computer modeling of single-layer nanocluster formation in a thin SiO 2 layer buried in Si by ion mixing and thermal phase decomposition

Prüfer, Thomas, Möller, Wolfhard, Heinig, Karl-Heinz, Wolf, Daniel, Engelmann, Hans-Jürgen, Xu, Xiaomo, von Borany, Johannes

Journal:

Journal of Applied Physics

Year:

2019

Language:

english

File:

PDF, 2.32 MB

english, 2019

25

Electron tomography of inlaid copper interconnect structures

Stegmann, Heiko, Engelmann, Hans-Jürgen, Zschech, Ehrenfried

Journal:

Microscopy and Microanalysis

Year:

2003

Language:

english

File:

PDF, 461 KB

english, 2003

26

Microstructure and degradation mechanisms of TaSiN diffusion barriers for Cu interconnects

Engelmann, Hans-Jürgen, Hübner, René, Hecker, Michael, Mattern, Norbert, Wenzel, Christian, Zschech, Ehrenfried, Wetzig, Klaus

Journal:

Microscopy and Microanalysis

Year:

2003

File:

PDF, 135 KB

2003

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